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Deposition Mask Defect Causes Specific Systems, Deposition Mask Defect Causes Specific Methods and Programs

机译:沉积掩模缺陷导致特定的系统,沉积掩模缺陷导致特定的方法和程序

摘要

A deposition mask defect cause specifying system for specifying a defect cause of a deposition mask having a substrate having a plurality of holes formed therein includes: a plurality of hole portions obtained by imaging the plurality of holes including normal hole portions and defective hole portions; an image acquisition unit that acquires a captured image of the deposition mask including a substrate portion in which the substrate around the substrate is imaged, and a first area that calculates the area of the top hole included in the captured image acquired by the image acquisition unit A calculation unit, a second area calculation unit for calculating the area of the defective hole portion included in the captured image acquired by the image acquisition unit, and calculating an area ratio that is a ratio of the area of the defective hole portion to the area of the normal hole portion and a defect cause specifying unit for specifying the cause of the defective hole portion; It is specified, and when the area ratio is less than 1, it is specified that the cause of the defective hole portion is a cause that is neither the first cause nor the second cause.
机译:沉积掩模缺陷导致用于指定具有形成其中多个孔的沉积掩模的缺陷原因的指定系统,该缺陷导致形成有多个孔的衬底包括:通过将包括正常孔部分和有缺陷孔部分的多个孔成像而获得的多个孔部分;图像获取单元,其获取包括衬底部分的沉积掩模的捕获图像,其中围绕基板围绕基板成像,以及计算由图像获取单元获取的捕获图像中的顶部孔的区域的第一区域计算单元,用于计算由图像获取单元获取的捕获图像中包括的缺陷孔部分的缺陷孔部分的区域的第二区域计算单元,并计算与该区域的缺陷孔部分的区域的比率的比率正常孔部分和缺陷导致指定单元,用于指定缺陷孔部分的原因;指定了,当面积比小于1时,指定缺陷孔部分的原因是既不是第一原因也不是第二原因的原因。

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