首页> 外国专利> THERMALLY CONDUCTIVE SILICONE GEL COMPOSITION AND THERMALLY CONDUCTIVE SILICONE GEL SHEET AND METHOD FOR PRODUCING SAME

THERMALLY CONDUCTIVE SILICONE GEL COMPOSITION AND THERMALLY CONDUCTIVE SILICONE GEL SHEET AND METHOD FOR PRODUCING SAME

机译:导热硅胶组合物和导热硅胶片及其制备方法

摘要

A thermally conductive silicone gel composition according to the present invention contains the following components A to D. A : a straight-chain organopolysiloxane that contains one vinyl group at each of the two terminals of the molecular chain and that has a kinematic viscosity of 1-600 mm2/s; B : a straight-chain organopolysiloxane that contains at least three Si-H groups in each molecule and has an Si-H group content of 0.05-6 mol/kg, in an amount that provides number of Si-H groups in component B/number of vinyl groups in component A = 0.2-0.5; C : a platinum catalyst in a catalytic amount; and D : a thermally conductive filler at 300-1,000 mass parts per 100 mass parts of the total amount of A and B.
机译:根据本发明的导热硅氧烷凝胶组合物含有以下组分A至D.A:一个直链有机聚硅氧烷,其在分子链的两个末端中的每一个处含有一个乙烯基,其具有1-的运动粘度 600 mm2 / s; B:一个直链有机聚硅氧烷,其在每个分子中含有至少三个Si-H组,并且具有0.05-6摩尔/千克的Si-H群含量,其量为组分B /中的Si-H组数量 组分A = 0.2-0.5中的乙烯基数量; C:催化量的铂催化剂; 和D:每100个质量份的300-1,000质量份的导热填料,每100个质量份A和B.

著录项

  • 公开/公告号WO2022009486A1

    专利类型

  • 公开/公告日2022-01-13

    原文格式PDF

  • 申请/专利权人 FUJI POLYMER INDUSTRIES CO. LTD.;

    申请/专利号WO2021JP12921

  • 发明设计人 KATAISHI TAKUMI;SUGIE MAI;KIMURA YUKO;

    申请日2021-03-26

  • 分类号C08L83/05;C08L83/07;C08K3/11;C08K3/22;

  • 国家 JP

  • 入库时间 2022-08-24 23:22:11

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