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Gas supply and layer deposition apparatus including the same

机译:包括相同的气体供应和层沉积设备

摘要

A gas supply for a layer deposition apparatus including a plurality of charge distribution lines connected to a first gas supply source and a plurality of gas filling tanks respectively connected to the charge distribution lines is disclosed. Each of the gas filling tanks may be pressurized with a first gas from the first gas supply source, and a gas supply line connected to a second gas supply source. The apparatus may include a multi-dosing valve assembly connected to outlet portions of the gas filling tanks and configured to supply, sequentially, the first gas from the gas filling tanks to a process chamber. The multi-dosing valve assembly may include a flow path block having a main supply line connected to the process chamber and a backflow prevention valve block fastened to the flow path block and having an opening/closing valve therein.
机译:公开了一种包括连接到第一气体供应源的多个电荷分配线的层沉积设备和分别连接到电荷分配线的多个气体填充槽的气体供应。 每个气体填充罐可以用来自第一气体供应源的第一气体加压,以及连接到第二气体供应源的气体供应管线。 该装置可包括多剂量阀组件,该多重定量阀组件连接到气体填充罐的出口,并且被配置为顺序地将来自气体填充罐的第一气体供应到处理室。 多剂量阀组件可包括流动路径块,该流动路径块具有连接到处理室的主供应管线和固定在流动路径块上的回流防止阀块并在其中具有开/闭阀。

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