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Package-before-etch three-dimensional package structure electrically connected by plated copper pillars and process thereof
Package-before-etch three-dimensional package structure electrically connected by plated copper pillars and process thereof
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机译:通过电镀铜柱和工艺电连接的包装前蚀刻三维封装结构
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摘要
The present invention relates to a package-before-etch three-dimensional package structure electrically connected by plated copper pillars and a process thereof. The process comprises the following steps: taking a metal carrier; preplating a surface of the metal carrier with a copper layer; forming an outer metal pin by means of electroplating; performing plastic packaging with epoxy resin; forming a metal circuit layer by means of electroplating; forming a conductive metal pillar by means of electroplating; surface-mounting a chip; performing plastic packaging; surface-mounting a passive device; performing plastic packaging; etching and windowing the carrier; forming an anti-oxidant metal layer by means of electroplating; and performing cutting to obtain a finished product. The integration level and the reliability can be improved.
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