CVD GAS FLOW PROFILE MODULATED CONTROL OF OVERLAY IN PLASMA CVD FILMS

摘要

Methods for controlling local stress and overlay error of one or more patterning films include adjusting a gas flow profile of gases introduced into a chamber body, flowing the gases within the chamber body towards a substrate, a substrate and unifying the center-to-edge temperature profile of the substrate by controlling the substrate temperature with a dual zone heater. A chamber for depositing a film may include a chamber body including one or more processing regions. The chamber body may include a gas distribution assembly having a blocker plate for delivering gases into one or more processing regions. The blocker plate may have a first area and a second area, and the first area and the second area may each have a plurality of holes. The chamber body may have a dual zone heater.