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ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF A SEMICONDUCTOR DIE AND A METAL REGION OF A SUBSTRATE
ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF A SEMICONDUCTOR DIE AND A METAL REGION OF A SUBSTRATE
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机译:具有在半导体管芯的金属区域和基板的金属区域之间的焊接的电子器件
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摘要
An electronic device includes: a first semiconductor die having a metal region; a substrate having a plurality of metal regions; a first soldered joint between the metal region of the first semiconductor die and a first metal region of the substrate, the first soldered joint having one or more intermetallic phases throughout the entire soldered joint, each of the one or more intermetallic phases formed from a solder preform diffused into the metal region of the first semiconductor die and the first metal region of the substrate; and a second semiconductor die soldered to the first or different metal region of the substrate.
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