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Spherical silver powder and its manufacturing method, and conductive paste

机译:球形银粉及其制造方法,以及导电浆料

摘要

PROBLEM TO BE SOLVED: To provide a spherical silver powder coping with reducing size of electronic component, increasing density or making fine line of a conductive pattern and a manufacturing method therefor and a conductive paste.SOLUTION: There are provided a spherical silver powder constituted by a plurality of silver particles, where a surface treatment agent exists on a surface of each silver particles, cumulative 50% particle diameter D50 in a laser diffraction particle size distribution measurement method is 0.1 μm to 2.0 μm, a ratio of D50 to cumulative 90% particle diameter D90 and cumulative 10% particle diameter D10, [(D90-D10)/D50] satisfies a relationship of 2.0 or less, cumulative 100% diameter Dmax is 5.0 μm or less and less than 7 times of D50 and average of spheroidicity is 1.0 to 1.5, and a technology related to the same.SELECTED DRAWING: Figure 1
机译:要解决的问题:提供一种球形银粉,其应对电子元件的减小尺寸,增加密度或制造导电图案的细线和制造方法和导电浆料:提供了一种由其构成的球形银粉。 多个银颗粒,其中表面处理剂在每个银颗粒的表面上存在,激光衍射粒度分布测量方法中的累积50%粒径D50为0.1μm至2.0μm,与累积的D50比率为90% 粒径D90和累积10%粒径D10,[(D90-D10)/ D50]满足2.0或更小的关系,累积100%直径Dmax为5.0μm或更小,小于D50的少于7倍,并且球形的平均值是 1.0至1.5,以及与其相关的技术。选择图:图1

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