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Silicon carbide shottky diode forward chracteristic is improved and manufacturing method thereof

机译:碳化硅肖特基二极管正向特性及其制造方法

摘要

The present invention provides a silicon carbide Schottky diode with improved forward characteristics and a method for manufacturing the same, comprising: forming a metal layer in which a Schottky metal layer-diffusion barrier metal layer-pad metal layer is laminated on an epitaxial layer; etching the metal layer; It is a technical gist to include the step of heat-treating the etched metal layer. Thereby, the diffusion barrier metal layer is formed between the pad metal layer and the Schottky metal layer, thereby preventing the Schottky metal layer from penetrating into the pad metal layer during heat treatment. In addition, it is possible to reduce the interfacial resistance and improve the Schottky bonding properties through high-temperature heat treatment.
机译:本发明提供一种具有改进的前向特性的碳化硅肖特基二极管和制造方法,包括:形成金属层,其中层叠在外延层上层叠肖特基金属层 - 扩散阻挡金属层焊盘金属层; 蚀刻金属层; 它是一种技术要素,包括热处理蚀刻金属层的步骤。 由此,在焊盘金属层和肖特基金属层之间形成扩散阻挡金属层,从而防止肖特基金属层在热处理期间渗透到垫金属层中。 另外,可以通过高温热处理降低界面抗性并改善肖特基粘接性能。

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