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CURABLE THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION WITH INCREASED THIXOTROPIC INDEX
CURABLE THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION WITH INCREASED THIXOTROPIC INDEX
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机译:可固化的导热聚硅氧烷组合物具有增加的触变指数
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摘要
A composition contains: (a) a vinyl-functional polysiloxane; (b) a silyl hydride functional polysiloxane having on average at least two silyl hydride groups per molecule; (c) 60 to 92 weight-percent thermally conductive filler; (d) a platinum hydrosilylation catalyst; and (e) 0.05 to 2.0 weight-percent of a trialkoxy-functional polysiloxane; where the trialkoxy -functional polysiloxane has two or more trialkoxy functionalities per molecule and a number average molecular weight of 1200 or more and where weight-percents are relative to the composition weight.
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