LED LED CHIP TRANSFERRING APPARATUS USING PHOTORESIST RESIN

摘要

The present invention is a technology for transferring an LED chip formed on a wafer to a substrate or a display panel, and a part of each chip attached to the substrate is selectively, sequentially, or It relates to an LED chip transfer device to which transfer technology is applied at intervals of time. An LED chip transfer apparatus using a photosensitive resin according to an embodiment of the present invention includes: a substrate; and a photosensitive resin layer formed on the substrate, a specific region is exposed by UV irradiation to form a photodegradation layer, and made of a photosensitive resin that expands at a predetermined temperature, wherein an LED chip is disposed on the photosensitive resin layer The lower portion of the LED chip is placed in a state embedded in the photosensitive resin layer by a clip-up structure, the photodegradation layer is expanded by applying a predetermined heat, and the LED chip located in the photodegradation layer It is a transfer device that cancels the adhesive force of the LED chip so that the LED chip can be peeled or transferred.