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PHOTOSENSITIVE TRANSFER RESIN FOR TRANSFERRING LED CHIP, METHOD FOR TRANSFERRING LED CHIP USING PHOTOSENSITIVE TRANSFER RESIN, AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING SAME
PHOTOSENSITIVE TRANSFER RESIN FOR TRANSFERRING LED CHIP, METHOD FOR TRANSFERRING LED CHIP USING PHOTOSENSITIVE TRANSFER RESIN, AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING SAME
The present invention relates to a photosensitive transfer resin, an LED chip transfer method, and a method for manufacturing a display device, to which are applied a technique for etching and separating LED chips formed on a wafer and transferring each of the separated chips to a carrier substrate, and a technique for using the photosensitive transfer resin to selectively transfer a portion of each of the chips transferred to the carrier substrate to another carrier substrate and a display panel in succession or at intervals. A photosensitive transfer resin for transferring an LED chip according to an embodiment of the present invention is prepared by mixing a photosensitive resin and a photoactive agent solution obtained by mixing a solvent and a photoactive agent powder. The photosensitive transfer resin can be expanded by heating without a development process following exposure, and thereby be used for peeling or transferring LED chips adhered to the photosensitive transfer resin.
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