LED CHIP TRANSFER METHOD AND APPARATUS USING FOAM AND PHOTOSENSITIVE RESIN, AND METHOD FOR MANUFACTURING DISPLAY DEVICE BY USING SAME

摘要

The present invention relates to an LED chip transfer method and a method for manufacturing a display device, the methods employing: a technology for etching and separating LED chips formed on a wafer to transfer the separated respective chips to a carrier substrate; and a technology for transferring some of the respective chips having been transferred to the carrier substrate to a carrier substrate and a display panel selectively, sequentially, or at a time interval, by using a foam and a photosensitive resin. An LED chip transfer apparatus using a foam and a photosensitive resin according to an embodiment of the present invention may include: a substrate; an expandable micro-capsule-photo resist (EMC-PR) layer formed on the substrate and made of a photosensitive resin including a foam foamed at a predetermined temperature; and an adhesive layer formed on the EMC-PR layer, wherein LED chips are disposed on the adhesive layer, and the EMC-PR layer includes a photo-induced degradation layer formed by exposing only a specific region thereof to light by a mask and UV irradiation.