PHOTORESIST TRANSFERRING RESIN FOR LED CHIP TRANSFERRING AND LED CHIP TRANSFERRING DEVICE USING PHOTORESIST TRANSFERRING RESIN

摘要

The present invention is a technology for transferring each separated chip to a carrier substrate by etching and separating the LED chip formed on the wafer, and a part of each chip transferred to the carrier substrate is selectively used as another carrier substrate and a display panel using a photosensitive transfer resin, The present invention relates to a photosensitive transfer resin, a method for transferring an LED chip, and a method for manufacturing a display device to which transfer technology is applied sequentially or at intervals of time. The photosensitive transfer resin for LED chip transfer according to an embodiment of the present invention comprises: a photosensitive resin; A photoactive agent solution in which a solvent and a photoactive agent are mixed; is prepared by mixing, and the adhesive force of the LED chip adhered to the photosensitive transfer resin is offset using the thermal expansion force of the photoactive agent, and the LED chip is peeled or transferred. can be used as