ULTRA-LARGE AREA SCANNING TYPE REACTIVE ION ETCHING MACHINE AND ETCHING METHOD

摘要

The present disclosure relates to a field of dry etching technology. The present disclosure provides an ultra-large area scanning reactive ion etching machine and an etching method thereof. The ultra-large area scanning reactive ion etching machine includes: an injection chamber (101), an etching reaction chamber (102), a transition chamber (103), and an etching ion generation chamber (104). By moving a sample holder (111) among the injection chamber (101), the etching reaction chamber (102) and the transition chamber (103) in a scanning direction, a scanning etching is performed on a sample (100) placed on the sample holder (111), which may realize a large-area, uniform and efficient etching.