Double sided cooling type semiconductor module, double-sided cooling type semiconductor device, and double-sided cooling type semiconductor module

摘要

Problem to be solved: to provide a method of manufacturing a double-sided cooling type semiconductor module, a double-sided cooling type semiconductor device, and a double-sided cooling type semiconductor module superior in reliability.Double sided cooling type semiconductor module 100Semiconductor device 1 andA first substrate 11a provided on one main surface side of a semiconductor deviceA second substrate 11b provided on the other main surface side of a semiconductor deviceA first joint 2 comprising a copper sintered body 31 for bonding a semiconductor element to a first substrateA second joint 4 comprising a copper sintered body 31 and a spacer 41 for joining the semiconductor device to the second substrate.Diagram