REFRIGERANT COOLED TYPE DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a refrigerant cooled type double-sided cooling semiconductor device having a simple structure, whereby dispersion in a pressing force due to dispersion in dimensions of each part and dispersion in a pressing force applied to each part of a flat refrigerant tube are reduced to uniformize the heat dissipation of each semiconductor chip or a semiconductor module, and to reduce dispersion in each part of the semiconductor chip or the semiconductor module.;SOLUTION: Double-sided cooled semiconductor modules 1 and the flat refrigerant tubes 2 are alternately layered, the flat refrigerant tubes 2 at both ends respectively configure an entrance header part 3 and an exit header part 4, and projected tubes 11, each projected from both ends of each flat refrigerant tube 2 in the layered direction, are joined for connecting the header parts in the layered direction. Each of the flat refrigerant tubes 2 has a contour part (a diaphragm plate part and a contractable part) 12 around each projected tube 11, and the contour part 12 absorbs the dimensional tolerance and prevents the clamping pressure from being consumed in the header parts.;COPYRIGHT: (C)2004,JPO&NCIPI