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Refrigerant cooling type double-sided cooling semiconductor device

机译:制冷剂冷却型双面冷却半导体装置

摘要

PPROBLEM TO BE SOLVED: To provide a coolant cooling type both sides cooling semiconductor device with simple structure and excellent heat dissipation capability. PSOLUTION: In the semiconductor device, while a both sides cooling type semiconductor module 1 and a coolant tube 2 with a flat contacting heat-receiving surface and with cooling fluid flowing inside, are closely contacted with an insulating spacer in between, both sides cooling type semiconductor module 1 is sandwiched and pressed with sandwiching and pressing members 6, 7, 10, between the coolant tubes 2, in a thickness direction of both sides cooling type semiconductor module 1, thereby simplifying structure, increasing cooling effect, and reducing irregularities of cooling effect. PCOPYRIGHT: (C)2010,JPO&INPIT
机译:

要解决的问题:提供一种结构简单且散热能力优异的冷却剂冷却型双面冷却半导体器件。

解决方案:在半导体器件中,虽然冷却型半导体模块1和冷却剂管2的两面均具有平坦的接触热接收表面,并且冷却液在内部流动,但两者之间均与绝缘垫片紧密接触,侧面冷却型半导体模块1在冷却剂管2之间被夹压构件6、7、10夹在中间,并在两侧冷却型半导体模块1的厚度方向上被加压,从而简化了结构,提高了冷却效果,并且减小了冷却效果。冷却效果不均匀。

版权:(C)2010,日本特许厅&INPIT

著录项

  • 公开/公告号JP5267412B2

    专利类型

  • 公开/公告日2013-08-21

    原文格式PDF

  • 申请/专利权人 株式会社デンソー;

    申请/专利号JP20090233387

  • 发明设计人 井上 誠司;

    申请日2009-10-07

  • 分类号H01L23/36;H01L23/473;H05K7/20;H02M7/48;

  • 国家 JP

  • 入库时间 2022-08-21 16:57:41

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