首页> 外国专利> Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material

Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material

机译:包括具有至少部分含有第二金属材料的第一金属材料具有含有第一金属材料并具有不同的结晶性而多的含金属材料的串行线。

摘要

Some embodiments include a memory array having a vertical stack of alternating insulative levels and wordline levels. Channel material extends vertically along the stack. The wordline levels include conductive regions which have a first metal-containing material and a second metal-containing material. The first metal-containing material at least partially surrounds the second metal-containing material. The first metal-containing material has a different crystallinity than the second metal-containing material. In some embodiments the first metal-containing material is substantially amorphous, and the second metal-containing material has a mean grain size within a range of from greater than or equal to about 5 nm to less than or equal to about 200 nm. Charge-storage regions are adjacent the wordline levels. Charge-blocking regions are between the charge-storage regions and the conductive regions.
机译:一些实施例包括具有交替绝缘电平和字线级别的垂直堆叠的存储器阵列。 沟道材料沿堆叠垂直延伸。 字线水平包括具有第一金属材料和第二金属材料的导电区域。 含第一金属材料至少部分地围绕含第二金属材料。 含第一金属材料具有不同的结晶性,而不是第二金属材料。 在一些实施方案中,含金属的材料基本上是无定形的,并且第二金属材料的平均晶粒尺寸在大于或等于约5nm至小于或等于约200nm的范围内。 电荷存储区域邻近字线级别。 电荷阻挡区域位于电荷储存区域和导电区域之间。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号