Method for manufacturing double-sided soldering of thick multilayer printed circuit boards

摘要

The present invention relates to a method for manufacturing thick multilayer printed circuit board double-sided soldering, A preheating step of setting the temperature in the PCB preheating tool and mounting and fixing the PCB; A flux application step of inserting a component into a through hole of the PCB and applying flux between the soldering area and the through hole; A soldering step in which a fillet is formed while soldering the “upper” and “lower” surfaces of the through hole by raising the iron temperature and forming a fillet; The present invention minimizes soldering time and soldering temperature to prevent deterioration of components or performance degradation due to thermal shock, improve soldering quality, and have significant economical effects.