Multi sensor package module for smart device and its manufacturing method

摘要

The present invention relates to a multi-sensor package module for smart devices and a method for manufacturing the same, which can reduce process costs by shortening a package process and significantly improve product performance. a light emitting device installed in; a plurality of light receiving devices installed on the edge of the integrated substrate and arranged at multiple angles on the radiation around the light emitting device to surround the periphery of the light emitting device; and a light-receiving device-integrated light-transmitting encapsulant formed in a ring shape by connecting the light-receiving devices to each other so as to integrally protect the plurality of light-receiving devices.