Temporary protective film for semiconductor sealing molding, its manufacturing method, lead frame with temporary protection film, molded molded body, and method for manufacturing semiconductor package

摘要

Problem to be solved: to provide a temporary protective film for forming a semiconductor seal molding which can be pasted with a suitable adhesive force to the lead frame and can be easily peeled after receiving a thermal hysteresis at a temperature of about 400.degree. C.Solution: the support film 1 and the adhesive layer 2 provided on one or both sides of the support film 1 are provided during sealing molding to form a sealing layer for sealing the semiconductor device mounted on the die pad of the lead frame A temporary protective film 10 for semiconductor sealing is used to temporarily protect the surface of the lead frame opposite to the semiconductor element.The adhesive layer 2 includes a thermoplastic resin and a small molecular additive of less than 1000 molecular weight.The weight reduction rate when the film consisting of 100 parts by weight of the thermoplastic resin and 10 parts by weight of the low molecular weight additive is heated from 25 ° C. to 420 ° C. is 10% or more with respect to the weight at 25 ° C.Diagram