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Direct inkjet printing of infrastructure for integrated circuits
Direct inkjet printing of infrastructure for integrated circuits
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机译:用于集成电路的基础设施的直接喷墨印刷
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摘要
This disclosure relates to a method for direct ink-jet printing of the infrastructure of a printing circuit. Specifically, the present disclosure relates to methods for direct ink-jet printing of heat dissipation elements and sockets for use in printed circuit boards (PCB), flexible printed circuit (FPC) and high density interconnect (HDI) printing circuits.Diagram
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