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DIRECT INKJET PRINTING OF INFRASTRUCTURE FOR INTEGRATED CIRCUITS
DIRECT INKJET PRINTING OF INFRASTRUCTURE FOR INTEGRATED CIRCUITS
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机译:直接喷墨印刷集成电路的基础设施印刷
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摘要
The disclosure relates to methods for direct inkjet printing of printed circuits' infrastructure. Specifically, the disclosure relates to methods for direct inkjet printing of heat- dissipation elements and sockets for use in printed circuit boards (PCBs), flexible printed circuits (FPCs) and high-density interconnect (HDI) printed circuits.
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