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DIRECT INKJET PRINTING OF INFRASTRUCTURE FOR INTEGRATED CIRCUITS
DIRECT INKJET PRINTING OF INFRASTRUCTURE FOR INTEGRATED CIRCUITS
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机译:直接喷墨印刷集成电路的基础设施印刷
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摘要
The disclosure relates to methods for direct ink jet printing of printed circuits' infrastructure. Specifically, the disclosure relates to methods for direct inkjet printing of heatdissipation elements and sockets for use in printed circuit boards (PCBs), flexible printed circuits (FPCs) and high-density interconnect (HDI) printed circuits.
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