首页> 外国专利> A method for manufacturing a base substrate for a semiconductor element, a method for manufacturing a semiconductor element, a base substrate for a semiconductor element, an epitaxial substrate for a semiconductor element, and a semiconductor element.

A method for manufacturing a base substrate for a semiconductor element, a method for manufacturing a semiconductor element, a base substrate for a semiconductor element, an epitaxial substrate for a semiconductor element, and a semiconductor element.

机译:一种用于制造半导体元件的基础基板的方法,一种用于制造半导体元件的方法,半导体元件的基础基板,半导体元件的外延基板和半导体元件。

摘要

PROBLEM TO BE SOLVED: To provide a base substrate capable of realizing a semiconductor element having excellent characteristics and a semiconductor element using the substrate. SOLUTION: A method for manufacturing a base substrate for a semiconductor element is a single crystal acquisition step of obtaining a plate-shaped Zn-doped GaN single crystal and forming an ashing damage layer on at least one main surface of the plate-shaped Zn-doped GaN single crystal. A damage layer forming step is provided, and in the damage layer forming step, a band when a He-Cd laser having an excitation wavelength of 325 nm is irradiated on one main surface at an excitation intensity of 800 W / cm2 to perform photoluminescence measurement. The ashing damage layer is formed by laser ashing one of the main surfaces so that the ratio of the luminescence intensity of the luminescence on the longer wavelength side than the band end to the luminescence intensity of the edge luminescence is 10% or more. [Selection diagram] Fig. 1
机译:要解决的问题:提供一种基材,其能够实现具有优异特性的半导体元件和使用基板的半导体元件。解决方案:用于制造半导体元件的基础基板的方法是获得板状Zn掺杂GaN单晶并在板状Zn的至少一个主表面上形成灰化损伤层的单晶获取步骤。掺杂GaN单晶。提供损伤层形成步骤,并且在损伤层形成步骤中,当在800W / cm 2的激发强度的激发强度下在一个主表面上照射具有激发波长325nm的HE-CD激光器以进行光致发光测量。通过激光灰色表面中的一个形成灰化损伤层,使得发光的发光强度与边缘发光的发光强度的频带端的发光的发光强度的比率为10%以上。 [选择图]图1

著录项

  • 公开/公告号JP2021155322A

    专利类型

  • 公开/公告日2021-10-07

    原文格式PDF

  • 申请/专利权人 日本碍子株式会社;

    申请/专利号JP20210029123

  • 发明设计人 杉山 智彦;前原 宗太;倉岡 義孝;

    申请日2021-02-25

  • 分类号C30B29/38;C30B33;C23C16/34;H01L21/205;H01L21/338;H01L29/778;H01L29/812;H01L21/20;H01L21/324;

  • 国家 JP

  • 入库时间 2022-08-24 21:32:20

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号