PREPARATION METHOD FOR STRAIN SENSITIVE FILM, STRAIN SENSITIVE FILM, AND PRESSURE SENSOR

摘要

A preparation method for a strain sensitive film, a strain sensitive film, and a pressure sensor. The preparation method comprises: performing thinning treatment on a semiconductor wafer to form a semiconductor film (S10); mounting a die attach film (102) on the semiconductor film (S20); performing cutting treatment on the semiconductor film to form a separate strain film (101) (S30); transferring the separate strain film (101) onto a substrate (100), and completely attaching the separate strain film (101) onto the substrate (100) (S40); performing electrical connection treatment on a metal pad on the separate strain film (101) and a corresponding metal pad of the substrate (100) (S50); and performing package treatment on the separate strain film (101) (S60). Therefore, a package process of the strain sensitive film is completed, and existing defects in chip-on-board package processes are mitigated.