ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION, ADHESIVE FILM FOR SEMICONDUCTOR, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.