The invention is based on the object of providing a base and an electronic component with the base, which provide improved cooling and high-frequency conduction. For this purpose, a base (1) is provided which has a base body (3) with several electrical feed-throughs (4), the feed-throughs (4) each having an opening (7) closed with insulation material (6) through which at least one feed-through conductor ( 8) is passed through electrically insulated from the base body (3), and wherein- a thermoelectric cooling element (16) is attached to the base body (3) so that the thermoelectric cooling element (16) can give off its waste heat generated during operation to the base body (3) , and wherein - a carrier (18) for an electronic component (2) is attached to the thermoelectric cooling element (16) so that the carrier (18) can be cooled with the thermoelectric cooling element (16), and wherein a first conductor track arrangement (11) with a first signal conductor (13) which is connected to a lead-through conductor (8) and at least one grounding conductor (14) is provided, and a second conductor track arrangement (12) on the carrier (18) for connecting the electronic component to a second signal conductor (15) and at least one grounding conductor (14), the two conductor track arrangements (11, 12) being separated by a gap (20), and the gap (20) having bonding wire connections (22 ), which connect the two signal conductors (13, 15) and the grounding conductors (14), and at least one of the opposite ends (110, 120) of the conductor track arrangements (11, 12) at the gap is a capacitive structural element (111, 121 ), which increases the capacitance of the conductor track arrangement (11, 12).
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