Cooling devices including a variable angle contact surface and methods for cooling heat-generating devices with a cooling device

摘要

A cooling device includes a substrate defining a substrate upper surface, and a fin positioned on the substrate upper surface, the fin including a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region, and a phase-change material encapsulated within the interior region, where the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer.