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STRAPPED COPPER INTERCONNECT FOR IMPROVED ELECTROMIGRATION RELIABILITY
STRAPPED COPPER INTERCONNECT FOR IMPROVED ELECTROMIGRATION RELIABILITY
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机译:捆绑铜互连,可提高电迁移可靠性
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摘要
A semiconductor device a strapped interconnect line, which in turn includes a first interconnect line at a first level above a semiconductor substrate, and a second interconnect line at a second level above the interconnect substrate. A dielectric capping layer is located directly on the first interconnect line. A plurality of strapping vias are connected between the first interconnect line and the second interconnect line. Each of the strapping vias extends from a first side of the first interconnect line to a second side of the second interconnect line.
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