Wafer soak temperature reading and control via thermocouple embedded end effector for semiconductor processing equipment

摘要

A workpiece handling system and method provides an end effector coupled to a workpiece transfer device. The end effector has a support member for selectively contacting and supporting a workpiece. One or more temperature sensors are coupled to the support member and configured to contact the back surface of the workpiece to measure and define one or more measured temperatures of the workpiece. The heating chuck has a support surface at a predetermined temperature and is configured to dissipate heat from the support surface. A controller controls the workpiece transfer device to selectively support the workpiece at a predetermined distance from the support surface of the heating chuck to radiatively heat the workpiece, wherein the end effector is based, at least in part, on the one or more measured temperatures. to selectively transfer the workpiece from to the support surface of the heating chuck.