Semiconductor package structure group with back surface shielding shielding layer and its manufacturing method

摘要

Problem to be solved: to provide a semiconductor package structure group having a back surface shielding layer and a manufacturing method thereof.Solution: the semiconductor package structure group with the backside shielding shielding layer adheres the mesh frame material 20 having a plurality of frame portions 21 to the sticky substrate 10, and then attaches each of the plurality of semiconductor elements 30 to the corresponding frame portion 21 and adheres to the pressure-sensitive substrate 10 in the frame portion 21 and further The semiconductor element 30 and the mesh frame 20 are manufactured by forming a metal layer 33.The frame portion 21 is formed so that the space formed between the peripheral portion of the bottom surface of each semiconductor element 30 and the corresponding frame portion 21 is smaller than the space formed between the bottom surface and the adhesive substrate 10.Diagram