DEVICE FOR COOLING HIGH-PERFORMANCE COMPUTERS OR HIGH-PERFORMANCE CIRCUITS, WITH TEMPERATURE CONTROL

摘要

The invention relates to a two-circuit cooling system within a technical basin (1), in which high-performance computers or high-performance circuits (2) are supported on an intermediate base (3). The intermediate base (3) has support feet (15) having a retainer (20) for a heat exchanger (13). The invention relates to a device and to a method for cooling one or more high-performance computers or high-performance circuits (2), preferably located in one or more housings (11), by means of a two-circuit cooling system, the high-performance computers or high-performance circuits (2) being immersed in a first cooling liquid (17), which in particular is a dielectric cooling liquid, in a completely liquid-tight, preferably cuboid-shaped basin (1), and a first cooling circuit having a pump (14) for circulating the first cooling liquid (17) being arranged in the basin (1), the first cooling liquid (17) being forced to flow through the housings (11) of the high-performance computers or high-performance circuits (2) during the circulation and the housings thus being cooled. A heat exchanger (13), a feed (12) and a return (10) of a second cooling circuit having the second cooling liquid (21) are accommodated in the basin (1), the heat exchanger (13) being immersed in the first cooling liquid (17) and the first cooling liquid (17) being cooled by means of a second cooling liquid (21).