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Device for cooling high-performance computers or circuits with temperature control

机译:带温度控制的冷却高性能计算机或电路的设备

摘要

The invention describes a two-circuit cooling system within a technical basin (1) in the high performance computer or circuits (2) on an intermediate floor (3) are stored. The intermediate floor (3) has feet (15) with a holder (20) for a heat exchanger (13). The invention relates to a device and a method for cooling of one or more, preferably in a housing (s) (11) high performance computers or circuits (2) with a two-circuit cooling system, the high-performance computer or circuits (2) in a completely liquid-tight running, preferably rectangular basins (1) in a particular dielectric first cooling liquid (17) are immersed and in the basin (1) a first cooling circuit with a pump (14) for circulating the first cooling liquid (17) is arranged, wherein the housing ( 11) of the high-performance computer or circuits (2) during the circulation of the first cooling liquid (17) flows through and thus cooled. In the basin (1), a heat exchanger (13), a flow (12) and a return (10) of a second cooling circuit with the second cooling liquid (21) housed, wherein the heat exchanger (13) in the first cooling liquid (17) is submerged and the first cooling liquid (17) using a second cooling liquid (21) is cooled.
机译:本发明描述了在高性能计算机的技术盆(1)内的两回路冷却系统,或者在中间楼层(3)上的回路(2)被存储。中间地板(3)具有支脚(15),其具有用于热交换器(13)的支架(20)。本发明涉及一种用于冷却一个或多个,优选在具有双回路冷却系统的高性能计算机或回路(2)的壳体(11)中的装置和方法,该高性能计算机或回路( 2)在完全液密的运行中,最好将矩形水槽(1)浸入特定的电介质第一冷却液(17)中,并在水槽(1)中浸入带有用于循环第一冷却的泵(14)的第一冷却回路布置液体(17),其中在第一冷却液(17)的循环期间,高性能计算机或电路(2)的壳体(11)流过并因此被冷却。在盆(1)中,热交换器(13),第二冷却回路的流(12)和回流(10)装有第二冷却液(21),其中第一热交换器(13)将冷却液(17)浸没,并使用第二冷却液(21)冷却第一冷却液(17)。

著录项

  • 公开/公告号AT520915B1

    专利类型

  • 公开/公告日2019-07-15

    原文格式PDF

  • 申请/专利权人 CLAUS HINTERECKER;CHRISTIAN RAUNEGGER;

    申请/专利号AT20180000272

  • 发明设计人

    申请日2018-09-04

  • 分类号H05K7/20;

  • 国家 AT

  • 入库时间 2022-08-21 11:59:44

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