REFLOW SOLDERING SYSTEM FOR COMBINED CONVECTION SOLDERING AND CONDENSATION SOLDERING

摘要

FIELD: process engineering. ;SUBSTANCE: invention can be used for fusible soldering of components of electronic assembly circuits. The brazing system (10) contains at least one zone (12) for the condensation process and at least one zone (11, 13) for the convection process. The control unit (100) is configured to control the soldering system (10) to ensure that the following operating modes are performed at a choice: convection brazing mode with the condensation process zone (12) turned off, the condensation brazing mode with the convection process zone (11, 13) turned off, the mode with an arbitrary combination of components of the zone (11, 13) of the convection process and the zone (12) of the condensation process for the implementation of complex soldering profiles. The brazing system (10) may have a conveyor (30) including a set of segments (31, 32, 33) for transporting the workpiece (20) through the zones of the brazing process and from one zone of the brazing process to another. The reflow soldering system (10) is capable of selectively supplying heat to the workpiece (20) with the regulation of the required temperature profile.;EFFECT: invention performs its functions effectively. ;15 cl, 1 dwg