WAFER WORKPIECE, PROVISIONAL ADHESIVE MATERIAL FOR WAFER WORKING, AND THIN WAFER MANUFACTURING METHOD

摘要

The present invention provides a wafer processing body in which a temporary adhesive layer is formed on a support, and a wafer having a circuit surface on the surface and a back surface to be processed is laminated on the temporary adhesive layer, wherein the temporary adhesive layer is A first temporary adhesive layer consisting of a thermoplastic organopolysiloxane polymer layer (A) releasably adhered to the surface of the wafer, and a second temporary consisting of a thermosetting siloxane-modified polymer layer (B) that is peelably laminated on the first temporary adhesive layer A wafer having a composite temporary adhesive layer having a three-layer structure of an adhesive layer and a third temporary adhesive layer comprising a thermosetting siloxane polymer layer (C) that is peelably laminated on the second temporary adhesive layer and peelably adhered to the support It is a processed object. Accordingly, there is provided a temporary adhesive material for wafer processing that is easy to perform temporary adhesion and peeling, and which can be easily peeled even when the thin wafer before peeling is cut, and a wafer processing body capable of increasing the productivity of the thin wafer.