首页> 外国专利> Wireless Communication Chip Having Internal Antenna, Internal Antenna for Wireless Communication Chip, and Method for Fabricating Wireless Communication Chip Having Internal Antenna

Wireless Communication Chip Having Internal Antenna, Internal Antenna for Wireless Communication Chip, and Method for Fabricating Wireless Communication Chip Having Internal Antenna

机译:具有内部天线的无线通信芯片,用于无线通信芯片的内部天线,以及制造具有内部天线的无线通信芯片的方法

摘要

A wireless communication chip having a built-in antenna according to an aspect of the present invention, in which the antenna is not designed in a mother board of an electronic device, but is built in a communication module, is a first mounting area 212 and a second mounting area 214 . The configured substrate 210: a wireless communication module 220 molded in the first mounting area 212; and an antenna block 230 mounted on the second mounting area 214 so as to be electrically connected to the wireless communication module 220 , wherein the antenna block 230 includes a first formed on the substrate 210 . antenna 240; a connection element 250 connected to the first antenna 240; an insulating layer 260 formed on the first antenna 240 and the connecting element 250 to cover the first antenna 240 and the connecting element 250 ; and a second surface formed on the insulation layer 260 such that a first surface is in contact with the insulation layer 260 and a second surface opposite to the first surface is exposed to the outside of the wireless communication chip 200 . An antenna 270 is included, and the second antenna 270 is electrically connected to the first antenna 240 through the connection element 250 .
机译:根据本发明的一个方面的具有内置天线的无线通信芯片,其中天线不是在电子设备的母板中设计的,而是内置于通信模块,是第一安装区域212和第二安装区域214。配置的基板210:在第一安装区域212中模制的无线通信模块220;安装在第二安装区域214上的天线块230,以便电连接到无线通信模块220,其中天线块230包括在基板210上形成的第一。天线240;连接到第一天线240的连接元件250;形成在第一天线240和连接元件250上的绝缘层260,以覆盖第一天线240和连接元件250;形成在绝缘层260上的第二表面,使得第一表面与绝缘层260接触,并且与第一表面相对的第二表面暴露于无线通信芯片200的外部。包括天线270,并且第二天线270通过连接元件250电连接到第一天线240。

著录项

  • 公开/公告号KR102266626B1

    专利类型

  • 公开/公告日2021-06-17

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR1020170090274

  • 申请日2017-07-17

  • 分类号H01Q1/22;H01Q1/38;H01R4/66;

  • 国家 KR

  • 入库时间 2022-08-24 19:49:03

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