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Techniques for fabricating charge balanced (CB) trench-metal-oxide-semiconductor field-effect transistor (MOSFET) devices

机译:用于制造电荷平衡(CB)沟槽 - 金属氧化物半导体场效应晶体管(MOSFET)装置的技术

摘要

A charge balanced (CB) trench-metal-oxide-semiconductor field-effect transistor (MOSFET) device may include a charge balanced (CB) layer defined within a first epitaxial (epi) layer that has a first conductivity type. The CB layer may include charge balanced (CB) regions that has a second conductivity type. The CB trench-MOSFET device may include a device layer defined in a second epi layer and having the first conductivity type, where the device layer is disposed on the CB layer. The device layer may include a source region, a base region, a trench feature, and a shield region having the second conductivity type disposed at a bottom surface of the trench feature. The device layer may also include a charge balanced (CB) bus region having the second conductivity type that extends between and electrically couples the CB regions of the CB layer to at least one region of the device layer having the second conductivity type.
机译:电荷平衡(CB)沟槽 - 金属氧化物半导体场效应晶体管(MOSFET)装置可以包括限定在具有第一导电类型的第一外延(EPI)层内的电荷平衡(CB)层。 CB层可以包括具有第二导电类型的电荷平衡(CB)区域。 CB沟槽 - MOSFET器件可以包括在第二EPI层中定义的设备层,并且具有第一导电类型,其中设备层设置在CB层上。装置层可以包括源区,基区,沟槽特征和具有设置在沟槽特征的底表面处的第二导电类型的屏蔽区域。器件层还可以包括具有第二导电类型的电荷平衡(Cb)母线区域,其延伸与具有第二导电类型的器件层的至少一个区域之间并将CB层的CB区域电耦合到至少一个区域。

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