LEAD-FREE SOLDER ALLOY COMPOSITION AND METHOD FOR PREPARING LEAD-FREE SOLDER ALLOY

摘要

This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt% Cu, Sn-(0.5 to 5) wt% Ag, or Sn-(0.1 to 2) wt% Cu-(0.5 to 5) wt% Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.