首页>
外国专利>
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
展开▼
机译:低温混合粘合的粘接垫
展开▼
页面导航
摘要
著录项
相似文献
摘要
Various chip stacks and methods and structures of interconnecting the same are disclosed. In one aspect, an apparatus is provided that includes a first semiconductor chip that has a first glass layer and plural first groups of plural conductor pads in the first glass layer. Each of the plural first groups of conductor pads is configured to bumplessly connect to a corresponding second group of plural conductor pads of a second semiconductor chip to make up a first interconnect of a plurality interconnects that connect the first semiconductor chip to the second semiconductor chip. The first glass layer is configured to bond to a second glass layer of the second semiconductor chip.
展开▼