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Sn replenishing material for plating liquid, method for producing Sn replenishing material for plating liquid, and method for replenishing Sn into plating liquid

机译:用于电镀液的SN补充材料,用于生产镀液的Sn补充材料的方法,以及将Sn重新加入电镀液中的方法

摘要

To provide an Sn replenisher for plating solution with an excellent storage stability that is hardly dispersed when being thrown into plating solution, the production method thereof, and an Sn replenishing method to plating solution.SOLUTION: An Sn replenisher for plating solution comprises a frozen body of a hydrous substance that includes water and stannous oxide powder and has a water-content rate of over 10 weight percent. The Sn replenisher for plating solution can be produced using a method of cooling and freezing a hydrous substance that includes water and stannous oxide powder and has a water-content rate of over 10 weight percent. In the Sn replenishing method to plating solution, the Sn replenisher for plating solution is thrown into the plating solution.SELECTED DRAWING: None
机译:为电镀溶液提供一种SN补充剂,​​具有出色的储存稳定性,当被抛出到电镀溶液时几乎不分散,其制备方法和镀液溶液的SN补充方法。凝固溶液的Sn补充剂包含冷冻体含水物质的含水物质和氧化锡粉末,水含量超过10重量%。电镀溶液的SN补充剂可以使用冷却和冷冻包含水和氧化亚氧化物粉末的含水物质的方法制备,其水含量超过10重量%。在镀液溶液的SN补充方法中,将镀层溶液的SN补充器抛入电镀液中。选择绘图:无

著录项

  • 公开/公告号JP6881075B2

    专利类型

  • 公开/公告日2021-06-02

    原文格式PDF

  • 申请/专利权人 三菱マテリアル株式会社;

    申请/专利号JP20170122422

  • 发明设计人 峯尾 恭平;平野 広隆;

    申请日2017-06-22

  • 分类号C25D21/14;C25D3/30;

  • 国家 JP

  • 入库时间 2022-08-24 19:11:15

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