Polishing apparatus and polishing method

摘要

Problem to be solved: to provide a polishing apparatus capable of making the polishing rate of the whole notch portion uniform.Polishing apparatus 1 comprisesHolding stage 14 having stage surface 14a holding substrate WA swing mechanism 20 for swinging the holding stage 14 in a plane parallel to the stage surface 14a andA polishing head 50 for contacting the polishing tape 31 to the notch portion N andA tension adjusting device 43A connected to the polishing head44a,73 andTension adjusting device44a,An operation control section 90 is connected toThe operation control section 90 includesTension adjusting device73 to issue the commandWhen the swing angle of the holding stage 14 is within a predetermined rangeThe tension of the polishing tape 31 is increased.The predetermined range isIncludes the angle at which the swing angle becomes maximum.Diagram