Polishing apparatus and polishing method

摘要

Problem to be solved: to provide a polishing apparatus capable of acquiring geometric elements such as pitch of patterns formed on a workpiece such as a wafer.Polishing apparatusPolishing table 3 for supporting polishing pad 2A polishing head 1 for pressing a workpiece W having a pattern against the polishing pad 2 to polish the surface of the work piece wArranged in the polishing tableAn imaging device 20 for generating an image including at least a pattern of a workpiece WAn image analyzing system 30 is provided for determining the geometric elements of the pattern of the work piece w based on the image.Diagram