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Deep Learning-based Adaptive Region of Interest for Measuring Critical Dimensions of Semiconductor Substrates

机译:基于深度学习的自适应感兴趣的区域,用于测量半导体基板的临界尺寸

摘要

The measurement system is started. In one embodiment, the system includes a characterization subsystem configured to acquire one or more images of a specimen. In another embodiment, the system: receives one or more training images of a sample from a characterization subsystem; Receive one or more training region of interest (ROI) selections within the one or more training images; Generate a machine learning classifier based on the one or more training images and the one or more training ROI selections; Receive one or more product images of the sample from the characterization subsystem; Generating one or more classified regions of interest using a machine learning classifier; And a controller configured to determine one or more measurements of the specimen within the one or more classified regions of interest.
机译:测量系统已启动。在一个实施例中,该系统包括用于被配置为获取样本的一个或多个图像的表征子系统。在另一个实施例中,系统:从表征子系统接收样本的一个或多个训练图像;在一个或多个培训图像中接收一个或多个招聘区域(ROI)选择;基于一个或多个训练图像和一个或多个训练ROI选择生成机器学习分类器;从表征子系统接收样本的一个或多个产品图像;使用机器学习分类器生成一个或多个分类区域;并且,控制器被配置为在一个或多个分类的感兴趣区域内确定样本的一个或多个测量值。

著录项

  • 公开/公告号KR20210057203A

    专利类型

  • 公开/公告日2021-05-20

    原文格式PDF

  • 申请/专利权人 케이엘에이 코포레이션;

    申请/专利号KR1020217013707

  • 发明设计人 야티 아르핏;

    申请日2019-10-01

  • 分类号H01L21/66;H01L21/67;

  • 国家 KR

  • 入库时间 2022-08-24 18:58:28

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