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Three-dimensional memory device containing alternating stack of source layers and drain layers and vertical gate electrodes

机译:包含源层和漏极层和垂直栅电极的交替堆叠的三维存储器件

摘要

A three-dimensional memory device includes an alternating stack of source layers and drain layers located over a substrate, gate electrodes vertically extending through each of the source layers and the drain layers of the alternating stack, memory films laterally surrounding a respective one of the gate electrodes, and semiconductor channels laterally surrounding a respective one of the memory films and connected to a respective vertically neighboring pair of a source layer and a drain layer. An array of memory openings can vertically extend through the alternating stack, and each of the gate electrodes can be located within a respective one of the memory openings.
机译:三维存储器件包括位于基板上的源极层和漏极层的交替叠层,栅电极垂直地延伸通过交替堆叠的每个源极层和漏极的漏极层,横向围绕栅极的相应一个栅极的存储器膜电极和横向围绕存储膜的相应一个的半导体通道,并连接到源极层和漏极的相应垂直相邻的对。一系列存储器开口可以通过交变堆叠垂直延伸,并且每个栅电极可以位于相应的一个存储器开口中。

著录项

  • 公开/公告号US11018153B2

    专利类型

  • 公开/公告日2021-05-25

    原文格式PDF

  • 申请/专利权人 SANDISK TECHNOLOGIES LLC;

    申请/专利号US201916539103

  • 申请日2019-08-13

  • 分类号H01L27/11582;H01L29/417;H01L27/11597;H01L29/10;

  • 国家 US

  • 入库时间 2024-06-14 21:35:00

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