Epoxy compound, method for producing the same, underfill material, semiconductor package and its manufacturing method

摘要

Epoxy compound capable of forming underfill material excellent in filling property prior to curing and exhibiting excellent heat resistance when hardened, and method for producing the same, and underfill material containing epoxy compound The semiconductor package thus sealed and the manufacturing method therefor.The structure and manufacturing method of the concrete epoxy compound (B-1) are listed below.No selection