SUBSTRATE WARPING MONITORING DEVICE, SUBSTRATE WARPING MONITORING METHOD, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE-TYPE SENSOR

摘要

The present invention includes: a sensing unit detachably attached to a substrate to detect information on warpage generated in a substrate while a processing process for the substrate is performed; By including a processor that generates information on the bending state of the substrate from the bending information detected by the sensing unit, the bending deformation of the substrate can be more accurately monitored by a simple configuration.