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Optical-mode selection for multi-mode semiconductor inspection

机译:多模半导体检查的光学模式选择

摘要

One or more semiconductor wafers or portions thereof are scanned using a primary optical mode, to identify defects. A plurality of the identified defects, including defects of a first class and defects of a second class, are selected and reviewed using an electron microscope. Based on this review, respective defects of the plurality are classified as defects of either the first class or the second class. The plurality of the identified defects is imaged using a plurality of secondary optical modes. One or more of the secondary optical modes are selected for use in conjunction with the primary optical mode, based on results of the scanning using the primary optical mode and the imaging using the plurality of secondary optical modes. Production semiconductor wafers are scanned for defects using the primary optical mode and the one or more selected secondary optical modes.
机译:使用主光学模式扫描一个或多个半导体晶片或其部分以识别缺陷。使用电子显微镜选择和审查多个识别的缺陷,包括第一类的缺陷和第二类的缺陷。基于该评价,多个多个缺陷被归类为第一类或第二类的缺陷。使用多个二次光学模式对多种识别的缺陷进行成像。基于使用主要光学模式和使用多个二次光学模式的扫描结果,选择一个或多个次要光学模式用于与主光学模式结合使用。使用主光学模式和一个或多个所选的二次光学模式扫描生产半导体晶片的缺陷。

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