PROBLEM TO BE SOLVED: To provide a misalignment inspection method, a misalignment inspection program and misalignment inspection device for performing a misalignment inspection for every transfer shot, and a misalignment inspection device selection method, a misalignment inspection device selection program and a misalignment inspection device selection system for reducing the time required for the inspection.;SOLUTION: In a method for inspecting a misalignment between a wafer W and a reticle using a plurality of inspection marks M arranged differently for every transfer shot TS, the plurality of inspection marks M on the transfer shot TS are counted (S401); one formula is selected, based on the result, among a plurality of first correction formulas for computing a first correction parameter ki used for performing a linear correction of the transfer shot TS (S402); the first correction parameter ki is computed (S403); a second correction parameter Pimn used for performing a linear correction of the wafer W is computed by substituting the first correction parameter ki into a second correction formula (S404); and the first correction parameter ki and the second correction parameter Pimn are output as an alignment correction value (S405).;COPYRIGHT: (C)2011,JPO&INPIT
展开▼
机译：解决的问题：提供一种错位检查方法，用于对每个转印镜头进行错位检查的错位检查程序和错位检查装置，以及错位检查装置的选择方法，错位检查装置选择程序和错位检查装置选择解决方案：在一种方法中，使用针对每个传送镜头TS布置不同的多个检查标记M来检查晶圆W和掩模版之间的未对准状态的方法中，晶片上的多个检查标记M对转移镜头TS进行计数（S401）;基于该结果，从多个第一校正公式中选择一个公式，以计算用于对转印镜头TS进行线性校正的第一校正参数k i 。计算第一校正参数k i （S403）;通过将第一校正参数k i 代入第二校正公式来计算用于对晶圆W进行线性校正的第二校正参数P imn （S404）; ;第一校正参数k i 和第二校正参数P imn 作为对齐校正值输出（S405）。COPYRIGHT：（C）2011，JPO＆INPIT
展开▼
