A method for producing a polyimide precursor, a method for producing a photosensitive resin composition, a method for producing a pattern cured product, a method for producing an interlayer insulating film, a cover coat layer or a surface protective film, and a method for producing an electronic component.

摘要

A method for producing a polyimide precursor having a structural unit represented by the following formula (1), which comprises the following (i) and (ii), and at least one of the above (i) and (ii) has an ether bond and an ether bond. A method for producing a polyimide precursor, which is carried out in a solvent containing a compound having an amide bond. (I) A step (ii) of reacting a carboxylic acid anhydride with a diamine compound to obtain a polyimide precursor having a structural unit represented by the following formula (2). The polyimide precursor to have is reacted with the compound represented by the following formula (8), and the reaction product is reacted with the compound represented by the following formula (9) to have a structure represented by the following formula (1). A step of obtaining a polyimide precursor having a unit (in the formula (1), at least one of R1 and R2 is a group represented by the formula (3)).